Fostering electronics development through 3D printing (Authentise Weekly News-In-Review – #126)
The field of electronics has been particularly prone to evolution in the past, with the shrinking of the circuitry and increasing of computational powers. However, it’s always been an inherently multi-step production process which reduces the opportunities for exploration into new shapes, material, and properties. 3D printing is beginning to apply its features to electronics as part of the multi-material printing push. This not only enables innovators to experiment much more freely with their PCBs, but iterations can also happen much more frequently. For testing purposes, this is the perfect combination. New satellites are being developed (and sent to the ISS) as well as new eco-friendly electronics that dissolve into the environment. For many companies, this is the means to a faster product development cycle for items that had to be ordered from China, shipped, tested and ordered anew with a few tweaks. The ability to print electronics in the lab is a very powerful tool.
International Space Station Will Test 3D-Printed Materials In Orbit
New 3D-printed materials are going to space thanks to a recently funded partnership between Israel’s NanoDimension and Florida’s Harris Corp. The companies plan to create new materials to reduce the manufacturing of small satellites, an exceedingly popular market right now for applications ranging from weather observations to remote surveillance.
Read the rest at Forbes.
Collaboration sparks sustainable electronics manufacturing breakthrough
Simon Fraser University and Swiss researchers are developing an eco-friendly, 3D printable solution for producing wireless Internet-of-Things (IoT) sensors that can be used and disposed of without contaminating the environment. SFU professor Woo Soo Kim is leading the research team’s discovery involving the use of a wood-derived cellulose material to replace the plastics and polymeric materials currently used in electronics.
Read the full article at EurekAlert.
NanoDimensions and Hensoldt Partner to Develop 3D Printed Sensor Technologies
Israeli 3D printed electronics manufacturer NanoDimension has partnered with Hensoldt, a German-headquartered sensor technology specialist. The two companies will use the DragonFly electronics 3D printer to develop applications for Hensoldt’s security and defense division. Thomas Stocker, Hensoldt’s Head of Engineering, said,
“Our focus is on providing our customers with the highest quality cutting-edge innovations […] By using the DragonFly, we’ve already accelerated our application development.”
Read the full article at 3D Printing Industry.
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